SI5476DU Datasheet, PDF (1/7 Pages) Vishay Siliconix – N-Channel 60-V (D-S) MOSFET

New Product
Si5476DU
Vishay Siliconix
N-Channel 60-V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
60
r_DS(on) (W)
0.034 at V_GS = 10 V
0.041 at V_GS = 4.5 V
I_D (A)^a
12
12
PowerPAKr ChipFETr Single
1
2
D
3
D
D
4
8
D
7
D
6
S
D
G
S
5
Bottom View
Q_g (Typ)
10.5 nC
FEATURES
D TrenchFETr Power MOSFET
D New Thermally Enhanced PowerPAKr
ChipFETr Package
– Small Footprint Area
– Low On-Resistance
– Thin 0.8-mm Profile
RoHS
COMPLIANT
APPLICATIONS
D Load Switch for Portable Applications
D DC–DC Switch for low power Synchronous Rectification
D Intermediate Switch Driver for
DC/DC Applications
D
Marking Code
AA XXX
Lot Traceability
and Date Code
G
Part # Code
Ordering Information: Si5476DU–T1–E3 (Lead (Pb)–free)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 _C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 _C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_C = 25 _C
T_C = 70 _C
T_A = 25 _C
T_A = 70 _C
T_C = 25 _C
T_A = 25 _C
L = 0.1 mH
T_C = 25 _C
T_C = 70 _C
T_A = 25 _C
T_A = 70 _C
V_DS
V_GS
I_D
I_DM
I_S
I_AS
E_AS
P_D
T_J, T_stg
60
" 20
12^a
12^a
7^{b, c}
5.6^{b, c}
25
12^a
2.6^{b, c}
15
11.2
31
20
3.1^{b, c}
2^{b, c}
– 55 to 150
260
Unit
V
A
mJ
W
_C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t p 5 sec
R_thJA
34
Steady State
R_thJC
3
40
_C/W
4
Notes:
a. Package limited.
b. Surface Mounted on 1” x 1” FR4 Board.
c. t = 5 sec.
d. See Solder Profile (http://www.vishay.com/doc?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 90 _C/W.
Document Number: 73663
S–60219—Rev. A, 20-Feb-06
www.vishay.com
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