MV036F022M055-CB Datasheet, PDF (9/10 Pages) Vicor Corporation – MV036 SERIES

End of Life - Please see First Page
Configuration Options
RECOMMENDED LAND PATTERN
(NO GROUNDING CLIPS)
TOP SIDE SHOWN
RECOMMENDED LAND PATTERN
(With GROUNDING CLIPS)
TOP SIDE SHOWN
MV036 SERIES
NOTES: 1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE
FREE OF COPPER, ALL PCB LAYERS.
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],
THIS PROVIDES 7.00 [0.275] COMPONENT
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]
CLEARANCE BETWEEN VICOR HEAT SINKS.
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],
THIS PROVIDES 8.50 [0.334] COMPONENT
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]
CLEARANCE BETWEEN VICOR HEAT SINKS.
3. V•I CHIP™ MODULE LAND PATTERN SHOWN
FOR REFERENCE ONLY; ACTUAL LAND PATTERN
MAY DIFFER. DIMENSIONS FROM EDGES OF
LAND PATTERN TO PUSH-PIN HOLES WILL BE
THE SAME FOR ALL FULL SIZE V•I CHIP PRODUCTS.
4. UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE MM [INCH].
TOLERANCES ARE:
X.X [X.XX] = ±0.3 [0.01]
X.XX [X.XXX] = ±0.13 [0.005]
5. PLATED THROUGH-HOLES FOR GROUNDING CLIPS (33855)
SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.
Figure 14 — Hole location for push pin heat sink relative to VI Chip^®
MIL-COTS Chip Transformer
Page 9 of 10
Rev 2.9
01/2014
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