PI3740-00 Datasheet, PDF (26/48 Pages) Vicor Corporation – Parallel capable with single wire current sharing

PI3740-00
Thermal Design
Figure 40 (a) shows a thermal impedance model that can predict the maximum temperature of the highest temperature component for
a given operating condition. This model assumes that all customer PCB connections are at one temperature, which is PCB equivalent
Temperature T_PCB °C. The model can be simplified as shown in Figure 40 (b).
SiP Power DissipaƟon
PD ( W )
Maximum Internal Temperature
TINT ( ^oC )
Thermal Resistance
Top Case
ɸINT-TOP ^oC / W
Top Case
Temperature
TTOP ^oC
Thermal Resistance _ɸINT-VIN
PCB Pads
o_{C / W}
ɸINT-VS1
o_{C / W}
ɸINT-PGND
o_{C / W}
ɸINT-VS2
o_{C / W}
ɸINT-VOUT
o_{C / W}
ɸINT-SGND
o_{C / W}
PCB Pads
TVIN
Temperature ^oC
TTOP ^oC
TVS1
o_C
TPGND
o_C
TVS2
o_C
TVOUT
o_C
TSGND
o_C
SiP Power DissipaƟon
PD ( W )
(a)
Maximum Internal Temperature
TINT ( ^oC )
Thermal Resistance
Top Case
ɸINT-TOP ^oC / W
Top Case
Temperature
TTOP ^oC
Thermal Resistance
PCB_equivalent
ɸINT-PCB ^oC / W
PCB equivalent
Temperature
TPCB ^oC
(b)
Figure 40 — PI3740-00 SiP Thermal Model (a) and its simplified version (b).
Cool-Power^® ZVS Switching Regulators
Page 26 of 48
Rev 1.4
04/2017
vicorpower.com
800 927.9474