PI352X-00 Datasheet, PDF (25/34 Pages) Vicor Corporation – 30VIN to 60VIN Cool-Power ZVS Buck Regulator

PI352x-00
φ_INT-TOP
φ_INT-PCB
φ_INT-VIN
φ_INT-VS1
φ_INT-PGND1
φ_INT-PGND2
φ_INT-SGND
the thermal impedance from the hottest component inside the SiP to the top side
the thermal impedance from the hottest component inside the SiP to the customer PCB, assuming all pins are
at one temperature.
the thermal impedance from the hottest component inside the SiP to the circuit board VIN pads.
the thermal impedance from the hottest component inside the SiP to the circuit board VS1 pads.
the thermal impedance from the hottest component inside the SiP to the circuit board at the PGND1 pads.
PGND1 is pins 12A-K.
the thermal impedance from the hottest component inside the SiP to the circuit board at the PGND2 pads .
PGND2 is pins 2F-J, 3F-J, 4C-J, 5B-J and 6C-K.
the thermal impedance from the hottest component inside the SiP to the circuit board at the SGND pads.
The following equation can predict the junction temperature
based on the heat load applied to the SiP and the known ambient
conditions with the simplified thermal circuit model:
T_INT =
PD +
T T _TOP
Φ ⁺ Φ _INT-TOP
PCB
INT-PCB
1
1
(1)
Φ ⁺ Φ _INT-TOP
INT-PCB
Product
System
PI3525-00
Simplified SiP
Thermal Impedances
φ_INT-TOP
(°C / W)
φ_INT-PCB
(°C / W)
68.7
1.477
PI3526-00
108
1.79
Table 2 — PI352x-00 SiP Thermal Impedance
φ_INT-TOP
(°C / W)
68.7
108.25
Detailed SiP Thermal Impedances
φ_INT-VIN
(°C / W)
3.34
φ_INT-VS1
(°C / W)
3.76
φ_INT-PGND1
(°C / W)
22.61
φ_INT-PGND2
(°C / W)
19.78
3.40
5.75
23.80
26.65
φ_INT-SGND
(°C / W)
58.78
86.44
Cool-Power^® ZVS Switching Regulators
Page 25 of 34
Rev 1.3
06/2017
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