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TC9WMA1FK Datasheet, PDF (7/12 Pages) Toshiba Semiconductor – TOSHIBA CMOS Digital Integrated Circuits Silicon Monolithic
TC9WMA1FK
Electrical Characteristics
D.C. Characteristics (GND = 0 V, VCC = 2.7~3.6 V, Topr = -40~85°C)
Characteristics
Input current
Output leakage current
High level output voltage
Low level output voltage
Quiescent supply current
Supply current during read
Supply current during all
erase/program
Symbol
Test Condition
ILI
ILO
VOH
VCC = 2.7 V, IOH = -1 mA
VOL
VCC = 2.7 V, IOL = 2 mA
ICC1 (Note1)
ICC2 (Note2)
ICC3 (Note3)
Min Typ. Max Unit
¾
¾
±5
mA
¾
¾
±5
mA
VCC -
0.4
¾
¾
V
¾
¾
0.4
V
¾¾
5
mA
¾
¾
1.5 mA
¾
¾
1.0 mA
Note 1: CS = 1 (except when busy, however)
Note 2: Current that flows for a period from a fall of the 14th to a fall of the 17th CLK pulse when executing the
read instruction.
Note 3: Current that flows while executing the all erase or program instruction.
A.C. Characteristics (GND = 0 V, VCC = 2.7~3.6 V, Topr = -40~85°C)
Characteristics
Symbol
Test Condition
Min
Maximum clock frequency
Minimum clock pulse width
Minimum reset pulse width
Minimum chip select pulse width
Reset setup time
Clock setup time
CS setup time
Propagation delay time
(Note4)
Input data setup time
Input data hold time
fMAX
0
twCLK (L)
400
twCLK (H)
tWRST
1
tWCS
1
tRSS
RST setup time when CS is
switched over
1
tCKS
CLK setup time when CS is switched
over
250
tCSS
CS setup time when CLK is
switched over
250
tpLH
tpHL
tpZH
Time from CLK switchover until valid
data is output
¾
tpZL
tpLZ
tpHZ
Time from CS switchover until output
data goes Hi-Z
¾
ts
Input data setup time when CLK is
switched over
250
th
Input data hold time when CLK is
switched over
250
Note 4: CL = 100 pF, RL = 1 kW
Max Unit
1
MHz
¾
ns
¾
ms
¾
ms
¾
ms
¾
ns
¾
ns
250
ns
500
¾
ns
¾
ns
7
2001-10-16