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TC58NYG1S3EBAI5 Datasheet, PDF (3/65 Pages) Toshiba Semiconductor – MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS 2 GBIT (256M × 8 BIT) CMOS NAND E2PROM
BLOCK DIAGRAM
I/O1
to
I/O8
CE
CLE
ALE
WE
RE
WP
RY / BY
I/O
Control circuit
Logic control
RY / BY
Status register
Address register
Command register
Control circuit
TC58NYG1S3EBAI5
VCC VSS
Column buffer
Column decoder
Data register
Sense amp
Memory cell array
HV generator
ABSOLUTE MAXIMUM RATINGS
SYMBOL
RATING
VCC
VIN
VI/O
PD
TSOLDER
TSTG
TOPR
Power Supply Voltage
Input Voltage
Input /Output Voltage
Power Dissipation
Soldering Temperature (10 s)
Storage Temperature
Operating Temperature
VALUE
−0.6 to 2.5
−0.6 to 2.5
−0.6 to VCC + 0.3 (≤ 2.5 V)
0.3
260
−55 to 125
-40 to 85
CAPACITANCE *(Ta = 25°C, f = 1 MHz)
SYMB0L
PARAMETER
CONDITION
MIN
CIN
Input
VIN = 0 V
⎯
COUT
Output
VOUT = 0 V
⎯
* This parameter is periodically sampled and is not tested for every device.
MAX
10
10
UNIT
V
V
V
W
°C
°C
°C
UNIT
pF
pF
3
2011-03-01C