TA1360AFG Datasheet, PDF (24/110 Pages) Toshiba Semiconductor – YCbCr/YPbPr Signal and Sync Processor for Digital TV, Progressive Scan TV and Double Scan TV

TA1360AFG
Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Supply voltage
Input pin signal voltage
Power dissipation
Power dissipation reduction rate
depending on temperature
Operating temperature
Storage temperature
Supply voltage (pins 16, 45 and 75)
V_CCmax
e_inmax
P_D (Note 3)
1/θja
T_opr
T_stg
min
typ.
max
12
9
2604
20.8
−20 to 65
−20 to 70
−55 to 150
8.7
8.5
9.0
8.8
9.3
9.1
V
Vp-p
mW
mW/°C
°C
°C
V
Note 3: See the following Figure A. (With device mounted on a PCB whose dimensions are 114.3 mm × 76.2 mm ×
1.6 mm and whose surface is 20% copper. Mount the device on a PCB of at least these dimensions and
whose surface is at least 20% copper.)
When using in −25 to 70°C of operating temperature, set the IC’s power supply voltage (pins 16, 45, 75) to
8.8 V (±0.3 V).
When designing a set, make sure that the IC can radiate heat because the TA1360AFG has low thermal
capacity. Note that the power dissipation varies greatly according to conditions of a board.
2604
1771
1667
0
0
25
65 70
150
Ambient temperature Ta (°C)
Figure A Power Dissipation Reduction Curve
24
2003-01-21