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TLP331_07 Datasheet, PDF (2/8 Pages) Toshiba Semiconductor – GaAs Ired & Photo−Transistor | |||
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Absolute Maximum Ratings (Ta = 25°C)
TLP331,TLP332
Characteristic
Symbol
Rating
Unit
Forward current
Forward current derating (Ta ⥠39°C)
Peak forward current (100μs pulse, 100pps)
Reverse Voltage
Junction temperature
Collectorâemitter voltage
Collectorâbase voltage (TLP331)
Emitterâcollector voltage
Emitterâbase voltage (TLP331)
Collector current
Power dissipation
Power dissipation derating (Ta ⥠25°C)
Junction temperature
Storage temperature range
Operating temperature range
Lead soldering temperature (10s)
Total package power dissipation
Total package power dissipation derating (Taâ¥25°C)
Isolation voltage (AC, 1min., RH ⤠60%)
IF
ÎIF /°C
IFP
VR
Tj
VCEO
VCBO
VECO
VEBO
IC
PC
ÎPC / °C
Tj
Tstg
Topr
Tsol
PT
PT/°C
(Note 1) BVS
50
â0.7
1
5
125
55
80
7
7
50
150
â1.5
125
â55~125
â55~100
260
250
â2.5
5000
mA
mA / °C
A
V
°C
V
V
V
V
mA
mW
mW / °C
°C
°C
°C
°C
mW
mW / °C
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(âHandling Precautionsâ/âDerating Concept and Methodsâ) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 1) Device considered a two terminal device: Pins 1, 2 and 3 shorted together and pins 4, 5 and 6 shorted
together.
Recommended Operating Conditions
Characteristic
Symbol
Min. Typ. Max. Unit
Supply voltage
Forward current
Collector current
Operating temperature
VCC
IF
IC
Topr
â
5
25
V
â
1.6
25
mA
â
1
10
mA
â25 â
75
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
2
2007-10-01
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