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SSM6N09FU_07 Datasheet, PDF (2/5 Pages) Toshiba Semiconductor – High Speed Switching Applications
Marking
6
5
4
DJ
Equivalent Circuit
(top view)
6
5
4
Q1
Q2
SSM6N09FU
Figure 1: 25.4 mm × 25.4 mm × 1.6 t,
Cu Pad: 0.32 mm2 × 6
0.4 mm
1
2
3
1
2
3
Electrical Characteristics (Ta = 25°C) (Q1, Q2 common)
Characteristics
Gate leakage current
Drain-Source breakdown voltage
Drain cut-off current
Gate threshold voltage
Forward transfer admittance
Drain-Source ON resistance
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time
Turn-on time
Turn-off time
Note2: Pulse test
Symbol
Test Condition
Min Typ. Max Unit
IGSS
VGS = ±16 V, VDS = 0
⎯
⎯
±1
μA
V (BR) DSS ID = 1 mA, VGS = 0
30
⎯
⎯
V
IDSS
VDS = 30 V, VGS = 0
⎯
⎯
1
μA
Vth
VDS = 5 V, ID = 0.1 mA
1.1
⎯
1.8
V
⎪Yfs⎪
VDS = 5 V, ID = 200 mA (Note2) 270
⎯
⎯
mS
ID = 200 mA, VGS = 10 V (Note2) ⎯
0.5 0.7
RDS (ON) ID = 200 mA, VGS = 4 V (Note2) ⎯
0.8 1.2
Ω
ID = 200 mA, VGS = 3.3 V (Note2) ⎯
1.0 1.7
Ciss
VDS = 5 V, VGS = 0, f = 1 MHz
⎯
20
⎯
pF
Crss
VDS = 5 V, VGS = 0, f = 1 MHz
⎯
7
⎯
pF
Coss
VDS = 5 V, VGS = 0, f = 1 MHz
⎯
16
⎯
pF
ton
VDD = 5 V, ID = 200 mA,
toff
VGS = 0~4 V
⎯
72
⎯
ns
⎯
68
⎯
Switching Time Test Circuit (Q1, Q2 Common)
(a) Test circuit
4V
IN
0
10 μs
VDD = 5 V
Duty <= 1%
VIN: tr, tf < 5 ns
(Zout = 50 Ω)
Common Source
Ta = 25°C
OUT
RL
VDD
(b) VIN
4V
0V
(c) VOUT
VDD
VDS (ON)
90%
10%
10%
90%
tr
tf
ton
toff
Precaution
Vth can be expressed as voltage between gate and source when low operating current value is ID = 100 μA for this
product. For normal switching operation, VGS (on) requires higher voltage than Vth and VGS (off) requires lower
voltage than Vth. (Relationship can be established as follows: VGS (off) < Vth < VGS (on) )
Please take this into consideration for using the device.
2
2007-11-01