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SSM3K14T_07 Datasheet, PDF (2/6 Pages) Toshiba Semiconductor – Silicon N Channel MOS Type DC-DC Converter
SSM3K14T
Electrical Characteristics (Ta = 25°C)
Characteristic
Gate leakage current
Drain-Source breakdown voltage
Drain Cut-off current
Gate threshold voltage
Forward transfer admittance
Drain-Source ON resistance
Total gate charge
Input capacitance
Reverse transfer capacitance
Output capacitance
Rise time
Switching time
Turn-on time
Fall time
Turn-off time
Note 3: Pulse test
Symbol
Test Condition
Min Typ. Max Unit
IGSS
VGS = ±16 V, VDS = 0
⎯
⎯
±1
μA
V (BR) DSS
V (BR) DSX
ID = 1 mA, VGS = 0
ID = 1 mA, VGS = −20 V
30
⎯
⎯
V
15
⎯
⎯
IDSS
VDS = 30 V, VGS = 0
⎯
⎯
1
μA
Vth
VDS = 5 V, ID = 0.1 mA
1.0
⎯
2.5
V
|Yfs|
VDS = 5 V, ID = 2 A
(Note 3) 3.2 6.4
⎯
S
ID = 2 A, VGS = 10 V
(Note 3) ⎯
31
39
RDS (ON) ID = 2 A, VGS = 4.5 V
(Note 3) ⎯
45
57
mΩ
ID = 2 A, VGS = 4.0 V
(Note 3) ⎯
50
67
Qg
VDD ∼− 24 V, ID = 4 A, VGS = 4 V
⎯
5.0
⎯
nC
Ciss
VDS = 15 V, VGS = 0, f = 1 MHz
⎯ 460 ⎯
pF
Crss
VDS = 15 V, VGS = 0, f = 1 MHz
⎯
62
⎯
pF
Coss
VDS = 15 V, VGS = 0, f = 1 MHz
⎯ 106 ⎯
pF
tr
⎯
15
⎯
ton
VDD = 15 V, ID = 2 A
tf
VGS = 0~4 V, RG = 10 Ω
⎯
24
⎯
ns
⎯
6
⎯
toff
⎯
19
⎯
Switching Time Test Circuit
(a) Test circuit
10 μs
4V
IN
0
Precaution
ID
VDD = 15 V
OUT RG = 10 Ω
D.U. <= 1%
VIN: tr, tf < 5 ns
Common Source
Ta = 25°C
VDD
4V
(b) VIN
10%
0
VDD
(c) VOUT
VDS (ON)
tr
ton
90%
10%
90%
tf
toff
Vth can be expressed as voltage between gate and source when low operating current value is ID = 100 μA for
this product. For normal switching operation, VGS (on) requires higher voltage than Vth and VGS (off) requires
lower voltage than Vth.
(relationship can be established as follows: VGS (off) < Vth < VGS (on) )
Please take this into consideration for using the device.
2
2007-11-01