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SSM3J13T_07 Datasheet, PDF (2/6 Pages) Toshiba Semiconductor – Field Effect Transistor Silicon P Channel MOS Type (U-MOSII)
SSM3J13T
Electrical Characteristics (Ta = 25°C)
Characteristics
Gate leakage current
Drain-Source breakdown voltage
Drain Cut-off current
Gate threshold voltage
Forward transfer admittance
Drain-Source ON resistance
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time
Turn-on time
Turn-off time
Note 3: Pulse test
Symbol
Test Condition
Min Typ. Max Unit
IGSS
VGS = ±8 V, VDS = 0
⎯
⎯
±1
μA
V (BR) DSS ID = −1 mA, VGS = 0
−12 ⎯
⎯
V
V (BR) DSX ID = −1 mA, VGS = 8 V
−4
⎯
⎯
V
IDSS
VDS = −12 V, VGS = 0
⎯
⎯
−1
μA
Vth
VDS = −3 V, ID = −0.1 mA
−0.45 ⎯
−1.1
V
|Yfs|
VDS = −3 V, ID = −1.5 A (Note 3) 3.8
⎯
⎯
S
ID = −1.5 A, VGS = −4 V (Note 3) ⎯
50
70
RDS (ON) ID = −1.5 A, VGS = −2.5 V (Note 3) ⎯
70
95
mΩ
ID = −1.5 A, VGS = −2.0 V (Note 3) ⎯
90 180
Ciss
VDS = −10 V, VGS = 0, f = 1 MHz
⎯ 890 ⎯
pF
Crss
VDS = −10 V, VGS = 0, f = 1 MHz
⎯ 203 ⎯
pF
Coss
VDS = −10 V, VGS = 0, f = 1 MHz
⎯ 288 ⎯
pF
ton
VDD = −10 V, ID = −1 A
toff
VGS = 0~−2.5 V, RG = 4.7 Ω
⎯
48
⎯
ns
⎯ 120 ⎯
Switching Time Test Circuit
(a) Test circuit
0
IN
−2.5 V
10 μs
(b) VIN
OUT
VDD = −10 V
RG = 4.7 Ω
D.U. <= 1%
VIN: tr, tf < 5 ns
COMMON SOURCE
Ta = 25°C
(c) VOUT
VDD
0V
−2.5 V
VDS (ON)
VDD
10%
90%
90%
10%
tr
tf
ton
toff
Precaution
Vth can be expressed as voltage between gate and source when low operating current value is ID = −100 μA
for this product. For normal switching operation, VGS (on) requires higher voltage than Vth and VGS (off)
requires lower voltage than Vth.
(relationship can be established as follows: VGS (off) < Vth < VGS (on))
Please take this into consideration for using the device.
2
2007-11-01