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2SJ680 Datasheet, PDF (2/5 Pages) Toshiba Semiconductor – Field Effect Transistor Silicon P-Channel MOS Type (π-MOS V)
2SJ680
Electrical Characteristics (Ta = 25°C)
Characteristic
Gate leakage current
Drain cutoff current
Drain-source breakdown voltage
Gate threshold voltage
Drain-source ON-resistance
Forward transfer admittance
Input capacitance
Reverse transfer capacitance
Output capacitance
Rise time
Switching time
Turn-on time
Fall time
Turn-off time
Total gate charge
(gate-source plus gate-drain)
Gate-source charge
Gate-drain (“Miller”) charge
Symbol
Test Condition
Min Typ. Max Unit
IGSS
IDSS
V (BR) DSS
Vth
RDS (ON)
⎪Yfs⎪
Ciss
Crss
Coss
VGS = ±16 V, VDS = 0 V
VDS = −200 V, VGS = 0 V
ID = −10 mA, VGS = 0 V
VDS = −10 V, ID = −1 mA
VGS = −10 V, ID = −1.5 A
VDS = −10 V, ID = −1.5 A
VDS = −10 V, VGS = 0 V, f = 1 MHz
⎯
⎯ ±10 µA
⎯
⎯ −100 µA
−200 ⎯
⎯
V
−1.5 ⎯ −3.5
V
⎯
1.6 2.0
Ω
1.0
2.0
⎯
S
⎯ 410 ⎯
⎯
40
⎯
pF
⎯ 145 ⎯
tr
0V
VGS
ton
−10 V
ID = −1.5 A VOUT
⎯
20
⎯
⎯
45
⎯
RL = 66.7 Ω
ns
tf
⎯
15
⎯
toff
Duty <= 1%, tw = 10 µs VDD ∼− −100 V
⎯
85
⎯
Qg
VDD ∼− −160 V, VGS = −10 V,
Qgs
ID = −2.5 A
Qgd
⎯
10
⎯
⎯
6
⎯
nC
⎯
4
⎯
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristic
Continuous drain reverse current
(Note 1)
Pulse drain reverse current
(Note 1)
Forward voltage (diode)
Reverse recovery time
Reverse recovery charge
Symbol
IDR
IDRP
VDSF
trr
Qrr
Test Condition
⎯
⎯
IDR = −2.5 A, VGS = 0 V
IDR = −2.5 A, VGS = 0 V,
dIDR/dt = 100 A/µs
Min Typ. Max Unit
⎯
⎯ −2.5
A
⎯
⎯ −10
A
⎯
⎯
2.0
V
⎯ 135 ⎯
ns
⎯ 0.81 ⎯
µC
Marking
J680
Part No. (or abbreviation code)
Lot No.
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
2
2004-12-24