XC6223D3019R-G Datasheet, PDF (32/36 Pages) Torex Semiconductor – Built-in Inrush Current Protection, 300mA High Speed LDO Voltage Regulator

XC6223 Series
■PACKAGING INFORMATION (Continued)
● SOT-89-5 Power Dissipation
Power dissipation data for the SOT-89-5 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
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1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 5 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Operating temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
25
85
Power Dissipation Pd（mW）
1300
520
Thermal Resistance (℃/W)
76.92
1400
1200
1000
800
600
400
200
0
25
Pd-Ta_P特_d性_vsグ_{. Ta}ラフ
45
65
85
105
125
Ambien_周t T_辺em_温pe_度rat_Tur_ae_（T_℃a _）(℃)
32/36