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XC6223D3019R-G Datasheet, PDF (31/36 Pages) Torex Semiconductor – Built-in Inrush Current Protection, 300mA High Speed LDO Voltage Regulator | |||
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XC6223
Series
â PACKAGING INFORMATION (Continued)
â SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125â)
Ambient Temperatureï¼âï¼
25
85
Power Dissipation Pdï¼mWï¼
600
240
è©Eva価luaåºtioæ¿n Bã¬oaã¤rdã¢(Uã¦nit:ãmï¼må) ä½ï¼mmï¼
Thermal Resistance (â/W)
166.67
700
600
500
400
300
200
100
0
25
Pd-TPadç¹vsæ§. Taã°ã©ã
45
65
85
105
125
Ambieå¨nt T辺em温pe度ratTuraeï¼Tâa (ï¼â)
31/36
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