XC6223D3019R-G Datasheet, PDF (28/36 Pages) Torex Semiconductor – Built-in Inrush Current Protection, 300mA High Speed LDO Voltage Regulator

XC6223 Series
■PACKAGING INFORMATION (Continued)
● USPQ-4B03 Power Dissipation
Power dissipation data for the USPQ-4B03 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
condition.
1. Measurement Condition (Reference data)
Condition
: Mount on a board
Ambient
: Natural convection
Soldering
: Lead (Pb) free
Board Dimensions : 40 x 40 mm (1600mm²)
Board Structure
: 4 Copper Layers
Each layer is connected to the package heat-sink and
terminal pin No.1.
Each layer has approximately 800mm² copper area.
Material
: Glass Epoxy (FR-4)
Thickness
: 1.6 mm
Through-hole
: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature
Evaluation Board (Unit: mm)
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
Power Dissipation Pd（mW） Thermal Resistance (℃/W)
25
550
181.82
85
220
600
500
400
300
200
100
0
25
Pd vs Ta
45
65
85
105
125
Ampient Temperature Ta（℃）
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