XC6223D3019R-G Datasheet, PDF (29/36 Pages) Torex Semiconductor – Built-in Inrush Current Protection, 300mA High Speed LDO Voltage Regulator

■PACKAGING INFORMATION (Continued)
● USP-4 Power Dissipation
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
XC6223
Series
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃） Power Dissipation Pd（mW）
25
1000
85
400
Evaluation Board (Unit: mm)
Thermal Resistance (℃/W)
100.00
1200
1000
800
600
400
200
0
25
Pd vs Ta
45
65
85
105
125
Ambient Temperature Ta（℃）
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