XC6217_2 Datasheet, PDF (28/33 Pages) Torex Semiconductor – High Speed "Green Operation" LDO Voltage Regulators

XC6217 Series
● USPN-4 Power Dissipation
Power dissipation data for the USPN-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the front and 50%
of the back.
The copper area is divided into four block, one block is
12.5% of total.
The USPN-4 package has for terminals.
Each terminal connects one copper block in the front and one
in the back.
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
Ambient Temperature(℃)
25
85
Power Dissipation Pd (mW)
600
240
Evaluation Board (Unit: mm)
Thermal Resistance(℃/W）
166.67
700
600
500
400
300
200
100
0
25
Pd vs Ta
45
65
85
105
125
Ambient Temperature Ta（℃）
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