XC6217_2 Datasheet, PDF (27/33 Pages) Torex Semiconductor – High Speed "Green Operation" LDO Voltage Regulators

● USP-4D Power Dissipation
Power dissipation data for the USP-4D is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm² in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
XC6217
Series
40
28.9
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
Ambient Temperature(℃)
25
85
Power Dissipation Pd (mW)
650
260
2.54 ^1.4
評価E基val板uaレtioイn Bアoウardト((U単ni位t: m：mm)m)
Thermal Resistance(℃/W）
153.8
700
600
500
400
300
200
100
0
25
Pd-T_Pa_d特_v性_{s T}グ_a ラフ
45
65
85
105
125
Ambie^周nt ^囲Te^温mp^度era^Ttu^are^{: (}T^℃a(℃⁾ )
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