OPA189 Datasheet, PDF (8/34 Pages) Texas Instruments – Precision, 36-V, 14-MHz, MUX-Friendly Low-Noise, Rail-to-Rail Output, Zero-Drift Operational Amplifiers

OPA189, OPA2189, OPA4189
SBOS830 – JUNE 2017
www.ti.com
7.4 Thermal Information: OPA189
THERMAL METRIC⁽¹⁾
D (SOIC)
OPA189
DGK (VSSOP)
DBV (SOT)
UNIT
8 PINS
8 PINS
5 PINS
R_θJA
R_θJC(top)
R_θJB
Ψ_JT
Ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
136
143
205
°C/W
74
47
200
°C/W
62
64
113
°C/W
19.7
5.3
38.2
°C/W
54.8
62.8
104.9
°C/W
N/A
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Thermal Information: OPA2189
THERMAL METRIC⁽¹⁾
D (SOIC)
OPA2189
DGK (VSSOP)
UNIT
8 PINS
8 PINS
R_θJA
Junction-to-ambient thermal resistance
136
R_θJC(top)
Junction-to-case (top) thermal resistance
74
R_θJB
Junction-to-board thermal resistance
62
Ψ_JT
Junction-to-top characterization parameter
19.7
Ψ_JB
Junction-to-board characterization parameter
54.8
R_θJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
143
°C/W
47
°C/W
64
°C/W
5.3
°C/W
62.8
°C/W
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.6 Thermal Information: OPA4189
THERMAL METRIC⁽¹⁾
D (SOIC)
OPA4189
PW (TSSOP)
UNIT
14 PINS
14 PINS
R_θJA
Junction-to-ambient thermal resistance
86
R_θJC(top)
Junction-to-case (top) thermal resistance
46
R_θJB
Junction-to-board thermal resistance
41
Ψ_JT
Junction-to-top characterization parameter
11.3
Ψ_JB
Junction-to-board characterization parameter
40.7
R_θJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
93
°C/W
28
°C/W
34
°C/W
1.9
°C/W
33.1
°C/W
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
8
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
Product Folder Links: OPA189 OPA2189 OPA4189