TCAN1042-Q1_17 Datasheet, PDF (7/40 Pages) Texas Instruments – Automotive Fault Protected CAN Transceiver with CAN FD

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7.3 Recommended Operating Conditions
V_CC
V_IO
I_OH(RXD)
I_OL(RXD)
5-V Bus Supply Voltage Range
I/O Level-Shifting Voltage Range
RXD terminal HIGH level output current
RXD terminal LOW level output current
TCAN1042-Q1, TCAN1042V-Q1, TCAN1042H-Q1
TCAN1042HV-Q1, TCAN1042G-Q1, TCAN1042GV-Q1
TCAN1042HG-Q1, TCAN1042HGV-Q1
SLLSES9B – FEBRUARY 2016 – REVISED MAY 2017
MIN MAX UNIT
4.5 5.5
V
3 5.5
–2
mA
2
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
TEST CONDITIONS
R_θJA
R_θJB
R_θJC(TOP)
Ψ_JT
Ψ_JB
T_TSD
T_{TSD_HYS}
Junction-to-air thermal resistance
Junction-to-board thermal resistance⁽³⁾
Junction-to-case (top) thermal resistance⁽⁴⁾
Junction-to-top characterization parameter⁽⁵⁾
Junction-to-board characterization parameter⁽⁶⁾
Thermal shutdown temperature
Thermal shutdown hysteresis
High-K thermal resistance⁽²⁾
TCAN1042-Q1
D (SOIC)
DRB (VSON)
8 Pins
8 Pins
105.8
40.2
46.8
49.7
48.3
15.7
8.7
0.6
46.2
15.9
170
170
5
5
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C
°C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(4) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(5) The junction-to-top characterization parameter, Ψ_JT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ_JA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, Ψ_JB estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ_JA, using a procedure described in JESD51-2a (sections 6 and 7).
7.5 Power Rating
PARAMETER
P_D
Average power dissipation
TEST CONDITIONS
V_CC = 5 V, V_IO = 5 V (if applicable), T_J = 27°C, R_L = 60 Ω, S at 0
V, Input to TXD at 250 kHz, C_{L_RXD} = 15 pF. Typical CAN
operating conditions at 500 kbps with 25% transmission
(dominant) rate.
V_CC = 5.5 V, V_IO = 5.5 V (if applicable), T_J = 150°C, R_L = 50 Ω,
S at 0 V, Input to TXD at 500 kHz, C_{L_RXD} = 15 pF. Typical high
load CAN operating conditions at 1 Mbps with 50% transmission
(dominant) rate and loaded network.
POWER DISSIPATION
52
124
UNIT
mW
mW
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Product Folder Links: TCAN1042-Q1 TCAN1042V-Q1 TCAN1042H-Q1 TCAN1042HV-Q1 TCAN1042G-Q1
TCAN1042GV-Q1 TCAN1042HG-Q1 TCAN1042HGV-Q1