LP3923_15 Datasheet, PDF (7/37 Pages) Texas Instruments – Cellular Phone Power Management Unit

LP3923
www.ti.com
SNVS567B – APRIL 2010 – REVISED MAY 2013
Absolute Maximum Ratings^(1)(2)(3)
CHG_IN (V_BATT=2.8-5.5V)
V_BATT=VIN1-2, BATT, HF_PWR, VINB
All other inputs
Junction Temperature (T_J-MAX)
Storage Temperature
Max Continuous Power Dissipation⁽⁴⁾
P_D-MAX ⁽⁵⁾
ESD ⁽⁶⁾
BATT, VIN1, VIN2, HF_PWR, CHG_IN, PWR_ON, VINB
−0.3V to +28V
−0.3V to +6.0V
−0.3V to V_BATT+0.3V, max 6.0V
150°C
−40°C to +150°C
Internally Limited
8 kV HBM
(1) All voltages are with respect to the potential at the GND pin.
(2) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply specified performance limits. For specified performance limits and
associated test conditions, see the Electrical Characteristics tables.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) Care must be exercised where high power dissipation is likely. The maximum ambient temperature may have to be derated. Maximum
ambient temperature (TA-MAX) is dependant on the maximum operating junction temperature (TJ-MAX-OP), the maximum power
dissipation of the device in the application (PD-MAX), and the junction to ambient thermal resistance of the package in the application
(θJA). This relationship is given by the following equation: TA-MAX = TJ-MAX-OP - (θJA x PD-MAX)
(5) Internal Thermal Shutdown circuitry protects the device from permanent damage.
(6) The human-body model is 100 pF discharged through 1.5 kΩ. The machine model is a 200 pF capacitor discharged directly into each
pin, MIL-STD-883 3015.7.
Operating Ratings⁽¹⁾⁽²⁾
CHG_IN ⁽³⁾
4.5 to 6.8V
V_BATT = VIN1-2, BATT, VINB
HF_PWR, PWR_ON
3.0V to 5.5V
0V to 5.5V
ACOK_N, SDA, SCL, RX_EN, TX_EN, TCXO_EN, PS_HOLD, RESET_N
All other pins
Junction Temperature (T_J)
Ambient Temperature (T_A)⁽⁴⁾
0V to (V_LDO + 0.3V)
0V to V_BATT + 0.3V)
−40°C to +125°C
−40°C to +85°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply specified performance limits. For specified performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pin.
(3) Full charging current is ensured for CHG_IN = 4.5 to 6.8V, but particularly at higher input voltages. Increased power dissipation may
cause the thermal regulation to limit the current to a safe level, resulting in longer charging time.
(4) All limits are specified. All electrical characteristics having room-temperature limits are tested during production with T_J = 25°C. All hot
and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
Thermal Properties⁽⁵⁾
Junction-to-Ambient Thermal Resistance (θ_JA)
(Jedec Standard Thermal PCB)
DSBGA 30
39°C/W
(5) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
General Electrical Characteristics
Unless otherwise noted, V_IN (= VIN1 = VIN2 = VINB = BATT) = 3.6V, GND = 0V, C_VIN1–2 = C_VINB = 10 µF, C_LDOx = 1 µF.
Typical values and limits appearing in normal type apply for T_J = 25°C. Limits appearing in boldface type apply over the
entire junction temperature range for operation, T_A = T_J = −40°C to +125°C.⁽¹⁾
(1) All limits are specified. All electrical characteristics having room-temperature limits are tested during production with T_J = 25°C. All hot
and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
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