THS7530-Q1 Datasheet, PDF (6/30 Pages) Texas Instruments – THS7530-Q1 High-Speed, Fully Differential, Continuously Variable Gain Amplifier

THS7530-Q1
SLOS932 – DECEMBER 2015
www.ti.com
Electrical Characteristics: Main Amplifier (continued)
V_S+ = 5 V, V_S– = 0 V, V_OCM = 2.5 V, V_ICM = 2.5 V, V_G- = 0 V, V_G+ = 1 V (maximum gain), T_A = 25°C, AC performance measured
using the AC test circuit shown in Figure 16 (unless otherwise noted). DC performance is measured using the DC test circuit
shown in Figure 17 (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Gain slope variation
Gain error
Gain control input bias current
V_G+ = 0 V to 0.9 V
V_G+ = 0 V to 0.15 V
V_G+ = 0.15 V to 0.9 V
±1.5
±4
±2.25
<1
dB/V
dB
µA
Gain control input resistance
40
kΩ
Gain control bandwidth
Small signal –3 dB
15
MHz
VOLTAGE CLAMPING
Output voltages (V_OUT±) relative to clamp
voltages (V_CL±)
Clamp voltage (V_CL±) input resistance
Clamp voltage (V_CL±) limits
POWER SUPPLY
Device In voltage limiting mode, T_A = 25°C
Device In voltage limiting mode, T_A = –40°C to +125°C
Device in voltage limiting mode
±25
3.3
V_S– to V_S+
±40
mV
±180
kΩ
V
Specified operating voltage
Maximum quiescent current
Power supply rejection (±PSRR)
POWER DOWN
T_A = 25°C
T_A = –40°C to +125°C
T_A = 25°C
T_A = –40°C to +125°C
T_A = 25°C
T_A = –40°C to +125°C
5
5.5
V
5.5
40
48
mA
49
70
77
dB
45
Enable voltage threshold
Disable voltage threshold
Power-down quiescent current
Input current high
Input current low
Input impedance
TTL low = shut down, T_A = 25°C
TTL low = shut down,
T_A = –40°C to +125°C
TTL high = normal operation, T_A = 25°C
TTL high = normal operation,
T_A = –40°C to +125°C
T_A = 25°C
T_A = –40°C to +125°C
T_A = 25°C
T_A = –40°C to +125°C
T_A = 25°C
T_A = –40°C to +125°C
1.4
1
1.4
0.35
±9
±109
50 || 1
V
1.65
0.4
0.55
±16
±19
±116
±130
V
mA
µA
µA
kΩ || pF
Turnon time delay
Measured to 50% quiescent current
820
ns
Turnoff time delay
Measured to 50% quiescent current
500
ns
Forward isolation in power down
80
dB
Input resistance in power down
>1
MΩ
Output resistance in power down
16
kΩ
6.6 Package Thermal Data
PACKAGE
PWP (14-pin)⁽²⁾
PCB
See Layout.
T_A = 25°C
POWER RATING⁽¹⁾
3W
(1) This data was taken using 2 oz trace and copper pad that is soldered directly to a 3 in × 3 in PCB.
(2) The THS7530-Q1 incorporates a PowerPAD on the underside of the chip. The PowerpAD acts as a heatsink and must be connected to
a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature
which could permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about using the
PowerPAD thermally enhanced package.
6
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