THS7530-Q1 Datasheet, PDF (4/30 Pages) Texas Instruments – THS7530-Q1 High-Speed, Fully Differential, Continuously Variable Gain Amplifier

THS7530-Q1
SLOS932 – DECEMBER 2015
6 Specifications
www.ti.com
6.1 Absolute Maximum Ratings
Over operating free-air temperature range, unless otherwise noted.⁽¹⁾
V_S+ – V_S–
V_I
I_O
V_ID
T_J
T_stg
Supply voltage
Input voltage
Output current
Differential input voltage
Continuous power dissipation
Maximum junction temperature
Maximum junction temperature for long term stability⁽²⁾
Storage temperature
MIN
MAX
UNIT
5.5
V
±V_S
V
65
mA
±4
V
See Thermal Information
150
°C
125
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
VALUE
±2000
±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
[V_S– to V_S+]
T_A
Supply voltage
Input common mode voltage
Output common mode voltage
Operating free-air temperature
[V_S– to V_S+] = 5 V
[V_S– to V_S+] = 5 V
MIN NOM MAX UNIT
4.5
5 5.5 V
2.5
V
2.5
V
–40
125 °C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
THS7530
PWP (HTSSOP)
UNIT
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
75.3
°C/W
35
°C/W
28.9
°C/W
1.6
°C/W
28.6
°C/W
3.2
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
Submit Documentation Feedback
Product Folder Links: THS7530-Q1
Copyright © 2015, Texas Instruments Incorporated