OPA172-Q1 Datasheet, PDF (6/36 Pages) Texas Instruments – 36-V, Single-Supply, 10-MHz, Rail-to-Rail Output Automotive Grade Operational Amplifiers

OPA172-Q1, OPA2172-Q1, OPA4172-Q1
SBOS809 – NOVEMBER 2016
www.ti.com
7.4 Thermal Information: OPA172-Q1
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
OPA172-Q1
DBV (SOT-23)
5 PINS
227.9
115.7
65.9
10.7
65.3
N/A
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Thermal Information: OPA2172-Q1
THERMAL METRIC⁽¹⁾
OPA2172-Q1
DGK (VSSOP)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
158
°C/W
48.6
°C/W
78.7
°C/W
3.9
°C/W
77.3
°C/W
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.6 Thermal Information: OPA4172-Q1
THERMAL METRIC⁽¹⁾
OPA4172-Q1
PW (TSSOP)
UNIT
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
111.1
40.8
54.1
3.8
53.3
N/A
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6
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