BQ2060SS Datasheet, PDF (53/59 Pages) Texas Instruments – SBS V1.1-COMPLIANT GAS GAUGE IC

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
BQ2060SS-E207-EP
BQ2060SS-E207-EPG4
BQ2060SS-E207TR-EP
BQ2060SS-E411
BQ2060SS-E411G4
BQ2060SS-E411TR
BQ2060SS-E411TRG4
BQ2060SSE207TREPG4
Status
(1)
NRND
NRND
NRND
NRND
NRND
NRND
NRND
NRND
Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C)
Drawing
Qty
(2)
(3)
SSOP
DBQ 28
40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR 0 to 70
& no Sb/Br)
SSOP
DBQ 28
40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR 0 to 70
& no Sb/Br)
SSOP
DBQ 28 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
0 to 70
SSOP
DBQ 28
40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
SSOP
DBQ 28
40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
SSOP
DBQ 28 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
SSOP
DBQ 28 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
SSOP
DBQ 28 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
0 to 70
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Top-Side Markings
(4)
2060SS
E207
2060SS
E207
2060SS
E207
2060SS
E411
2060SS
E411
2060SS
E411
2060SS
E411
2060SS
E207
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Samples
Addendum-Page 1