LMH6642_16 Datasheet, PDF (5/39 Pages) Texas Instruments – LMH664x Low Power, 130 MHz, 75 mA Rail-to-Rail Output Amplifiers

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LMH6642, LMH6643, LMH6644
SNOS966Q – MAY 2001 – REVISED SEPTEMBER 2014
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾⁽²⁾
over operating free-air temperature range (unless otherwise noted)
V_IN Differential
Output Short Circuit Duration
Supply Voltage (V⁺ - V^−)
Voltage at Input/Output pins
Input Current
Junction Temperature⁽⁵⁾
Soldering Information
Infrared or Convection Reflow (20 sec)
Wave Soldering Lead Temp.(10 sec)
MIN
MAX
±2.5
See ⁽³⁾ and ⁽⁴⁾
13.5
V⁺ +0.8
V^− −0.8
±10
+150
235
260
UNIT
V
V
V
mA
°C
°C
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(4) Output short circuit duration is infinite for V_S < 6V at room temperature and below. For V_S > 6V, allowable short circuit duration is 1.5ms.
(5) The maximum power dissipation is a function of T_J(MAX), R_θJA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/ R_θJA . All numbers apply for packages soldered directly onto a PC board.
7.2 Handling Ratings
MIN
T_stg
Storage temperature range
−65
V_(ESD)
Electrostatic
discharge ⁽¹⁾
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
all pins⁽²⁾
Machine model (MM)⁽³⁾
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins⁽⁴⁾
MAX
+150
2000
200
1000
(1) Human body model, 1.5 kΩ in series with 100 pF. Machine Model, 0 Ω in series with 200 pF.
(2) JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.
(3) JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process.
(4) JEDEC document JEP157 states that 1000-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
°C
V
7.3 Recommended Operating Conditions⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Supply Voltage (V⁺ – V^−)
Operating Temperature Range⁽²⁾
MIN
MAX UNIT
2.7
12.8 V
−40
+85 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T_J(MAX), R_θJA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/ R_θJA. All numbers apply for packages soldered directly onto a PC board.
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMH6642
DBV05A
D08A
LMH6643
DGK08A
LMH6644
D14A
PW14A
UNIT
R_θJA
Junction-to-ambient Thermal Resistance⁽²⁾
5 PINS
265
8 PINS
190
8 PINS
235
14 PINS
145
14 PINS
155
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of T_J(MAX), R_θJA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/ R_θJA. All numbers apply for packages soldered directly onto a PC board.
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