LM3687 Datasheet, PDF (5/35 Pages) National Semiconductor (TI) – Step-Down DC-DC Converter with Integrated Low Dropout Regulator and Startup Mode

LM3687
www.ti.com
SNVS473A – DECEMBER 2007 – REVISED JULY 2008
Output Voltage Option
V_{OUT_DCDC}
V_{OUT_LIN}
1.80V
1.20V
1.80V *
1.30V *
Order Number
LM3687TL-1812
LM3687TLX-1812
LM3687TL-1813
LM3687TLX-1813
Package Marking
SB
SB
tbd
tbd
Supplied as
250 units, tape and reel,
lead free
3000 units, tape and reel,
lead free
250 units, tape and reel,
lead free
3000 units, tape and reel,
lead free
Flow
NOPB
NOPB
NOPB
NOPB
* For availability or other output voltage combinations please contact your local NSC sales office
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ^{(1) (2)}
V_{IN_LIN}, V_BATT pins: Voltage to GND,
V_{IN_LIN}≤ V_BATT
V_{IN_LIN} pin to V_BATT pin
Enable pins,
Feedback pin,
SW pin
Continuous Power Dissipation⁽³⁾
Junction Temperature (T_J-MAX )
Storage Temperature Range
Package Peak Reflow Temperature (Pb-free, 10-20 sec.) ⁽⁴⁾
ESD Rating ⁽⁵⁾
Human Body Model:
Machine Model
-0.2V to 6.0V
0.2V
(GND-0.2V) to
(V_BATT+0.2V) with
6.0V max
Internally Limited
150°C
-65°C to + 150°C
260°C
2.0kV
200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the SGND pin.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 160°C (typ.) and
disengages at T_J = 140°C (typ.).
(4) For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1112: Micro SMD Wafer
Level Chip Scale Package (AN-1112).
(5) The Human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF
capacitor discharged directly into each pin. (MIL-STD-883 3015.7)
Operating Ratings ^{(1) (2)}
Input Voltage Range V_BATT
(3)
Input Voltage Range V_{IN_LIN}
Junction Temperature (T_J) Range
Ambient Temperature (T_A) Range
(4)
2.7V to 5.5V
(≥V_{OUT_LIN(NOM)} + 1.5V and
≥V_{OUT_DCDC(NOM)} + 1.0V)
(V_{OUT_LIN(NOM)} + 0.25V) to 4.5V
-30°C to + 125°C
-30°C to + 125°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the SGND pin.
(3) The battery input voltage range recommended for ideal applications performance for the specified output voltages is given as follows:
V_BATT = 2.7V to 5.5V for 1.0V < V_{OUT_DCDC} < 1.8V; V_BATT = (V_{OUT_DCDC} +1V) to 5.5V for 1.8V ≤ V_{OUT_DCDC} ≤ 1.875V
(4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θ_JA), as given by the following equation: T_A-MAX = T_J-MAX-OP – (θ_JA × P_D-MAX).
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