DRV8823_16 Datasheet, PDF (5/32 Pages) Texas Instruments – 4-Bridge Serial Interface Motor Driver

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DRV8823
SLVS913E – JANUARY 2009 – REVISED JANUARY 2016
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted)^{(1) (2)}
V_M
V_I
I_O(peak)
I_O
P_D
T_J
T_A
T_stg
Power supply voltage
Logic input voltage⁽³⁾
Peak motor drive output current, t < 1 μs
Motor drive output current⁽⁴⁾
Continuous total power dissipation
Operating virtual junction temperature
Operating ambient temperature
Storage temperature
MIN
MAX
–0.3
34
–0.5
5.75
Internally limited
1.5
See Dissipation Ratings
–40
150
–40
85
–60
150
UNIT
V
V
A
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Input pins may be driven in this voltage range regardless of presence or absence of V_M.
(4) Power dissipation and thermal limits must be observed.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_M
I_MOT
V_REF
Motor power supply voltage range
Continuous motor drive output current⁽¹⁾
VREF input voltage⁽²⁾
(1) Power dissipation and thermal limits must be observed.
(2) Operational at VREF between 0 and 1 V, but accuracy is degraded.
MIN NOM MAX UNIT
8
32
V
1
1.5
A
1
4
V
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DRV8823
DCA (HTSSOP)
UNIT
48 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
31.3
°C/W
16.3
°C/W
15
°C/W
0.6
°C/W
14.9
°C/W
0.6
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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