CC2640R2F-Q1 Datasheet, PDF (5/40 Pages) Texas Instruments – SimpleLink Bluetooth low energy Wireless MCU for Automotive

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CC2640R2F-Q1
SWRS201 – JANUARY 2017
3 Device Comparison
Table 3-1. Device Family Overview
DEVICE
CC2640R2F-Q1 ⁽²⁾
PHY SUPPORT
Bluetooth low energy (Automotive)
FLASH
(KB)
128
RAM
(KB)
20
GPIO
31
PACKAGE ⁽¹⁾
RGZ (Wettable Flanks)
CC2640R2Fxxx ⁽²⁾
Bluetooth low energy (Normal, High
Speed, Long Range)
128
20
31, 15, 14, 10 RGZ, RHB, YFV, RSM
CC2650F128xxx
Multi-Protocol
128
20
31, 15, 10
RGZ, RHB, RSM
CC2640F128xxx
Bluetooth low energy (Normal)
128
CC2630F128xxx
IEEE 802.15.4 ( ZigBee^®/6LoWPAN)
128
20
31, 15, 10
RGZ, RHB, RSM
20
31, 15, 10
RGZ, RHB, RSM
CC2620F128xxx
IEEE 802.15.4 (RF4CE)
128
20
31, 10
RGZ, RSM
(1) Package designator replaces the xxx in device name to form a complete device name, RGZ is 7-mm × 7-mm VQFN48, RHB is 5-mm ×
5-mm VQFN32, RSM is 4-mm × 4-mm VQFN32, and YFV is 2.7-mm × 2.7-mm DSBGA..
(2) CC2640R2Fxxx devices contain Bluetooth 4.2 Host and Controller libraries in ROM, leaving more of the 128KB of flash available for
the customer application when used with supported BLE-Stack software protocol stack releases. Actual use of ROM and flash by
the protocol stack may vary depending on device software configuration. See Bluetooth low energy Stack for more details.
Table 3-2. Typical⁽¹⁾ Flash Memory Available for Customer Applications
Device
CC2640R2Fxxx, CC2640R2F-Q1⁽⁴⁾
Simple BLE Peripheral (BT 4.0)⁽²⁾
83 KB
Simple BLE Peripheral (BT 4.2)^{(2) (3)}
80 KB
CC2640F128xxx, CC2650F128xxx
41 KB
31 KB
(1) Actual use of ROM and flash by the protocol stack will vary depending on device software configuration. The values in this table are
provided as guidance only.
(2) Application example with two services (GAP and Simple Profile). Compiled using IAR.
(3) BT4.2 configuration including Secure Pairing, Privacy 1.2, and Data Length Extension
(4) Bluetooth low energy applications running on the CC2640R2F-Q1 device make use of up to 115 KB of system ROM and up to 32 KB of
RF Core ROM in order to minimize the flash usage. The maximum amount of nonvolatile memory available for Bluetooth low energy
applications on CC2640R2F-Q1 is thus 275 KB (128-KB flash + 147-KB ROM).
3.1 Related Products
Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low power RF
solutions suitable for a broad range of applications. The offerings range from fully
customized solutions to turn key offerings with pre-certified hardware and software
(protocol).
TI's SimpleLink™ Sub-1 GHz Wireless MCUs Long-range, low-power wireless connectivity solutions
are offered in a wide range of Sub-1 GHz ISM bands.
Companion Products Review products that are frequently purchased or used in conjunction with this
product.
SimpleLink™ CC2640R2 Wireless MCU LaunchPad™ Development Kit
The CC2640R2 LaunchPad ™ development kit brings easy Bluetooth^® low energy (BLE)
connection to the LaunchPad ecosystem with the SimpleLink ultra-low power CC26xx family
of devices. Compared to the CC2650 LaunchPad, the CC2640R2 LaunchPad provides the
following:
• More free flash memory for the user application in the CC2640R2 wireless MCU
• Out-of-the-box support for Bluetooth 4.2 specification
• 4× faster Over-the-Air download speed compared to Bluetooth 4.1
SimpleLink™ Bluetooth low energy/Multi-standard SensorTag
The new SensorTag IoT kit invites you to realize your cloud-connected product idea. The
new SensorTag now includes 10 low-power MEMS sensors in a tiny red package. And it is
expandable with DevPacks to make it easy to add your own sensors or actuators.
Reference Designs for CC2640 TI Designs Reference Design Library is a robust reference design library
spanning analog, embedded processor and connectivity. Created by TI experts to help you
jump-start your system design, all TI Designs include schematic or block diagrams, BOMs
and design files to speed your time to market. Search and download designs at
ti.com/tidesigns.
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