BQ24085_17 Datasheet, PDF (5/42 Pages) Texas Instruments – 750-mA Single-Chip Li-Ion and Li-Pol Charge Management IC With Thermal Regulation

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bq24085, bq24086, bq24087, bq24088
SLUS784E – DECEMBER 2007 – REVISED DECEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾
Supply voltage (IN with respect to Vss)
MIN
–0.3
MAX
20
UNIT
V ⁽²⁾
Input voltage on IN, STATx, PG, TS, CE, TMR (all with respect to Vss)
–0.3
V(IN)
V
Input voltage on OUT, BAT, ISET (all with respect to Vss)
–0.3
7
V
Output sink current (STATx) + PG
15
mA
Output current (OUT pin)
2
A
T_A Operating free-air temperature
T_J Junction temperature
T_stg Storage temperature
–40
155
°C
–40
150
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) The bq24085/6/7/8 family can withstand up to 18 V maximum continuously, 20 V for maximum of 2000 hours and 26 V for a maximum
for 87 hours.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±3000
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
V_(IN)
V_(IN)
R_(TMR)
T_J
Supply voltage
Supply voltage
Safety timer program resistor
Junction temperature
Battery absent detection not functional
Battery absent detection functional
MIN
MAX
UNIT
3.5
4.35
V
4.35
6.5
V
33
100
KΩ
0
125
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq2408x
DRC (VSON)
UNIT
10 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
46.7
°C/W
65.9
°C/W
21.3
°C/W
1.6
°C/W
21.4
°C/W
3.6
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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