BQ24085_17 Datasheet, PDF (4/42 Pages) Texas Instruments – 750-mA Single-Chip Li-Ion and Li-Pol Charge Management IC With Thermal Regulation

bq24085, bq24086, bq24087, bq24088
SLUS784E – DECEMBER 2007 – REVISED DECEMBER 2015
6 Pin Configuration and Functions
bq24086 and bq24088 DRC Package
10-Pin VSON
Top View
1 IN
2 TMR
3 STAT 1
4 STAT 2
5 VSS
OUT 10
BAT 9
TS 8
PG 7
ISET 6
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bq24085 DRC Package
10-Pin VSON
Top View
1 IN
2 TMR
3 STAT 1
4 STAT 2
5 VSS
OUT 10
BAT 9
CE 8
PG 7
ISET 6
bq24087 DRC Package
10-Pin VSON
Top View
1 IN
2 TMR
3 STAT 1
4 STAT 2
5 VSS
OUT 10
BAT 9
TE 8
CE 7
ISET 6
NAME
BAT
CE
IN
ISET
OUT
PG
STAT1
STAT2
TE
TMR
TS
VSS
Exposed
Thermal
Pad
PIN
bq24086/8 bq24085 bq24087
9
9
9
–
8
7
1
1
1
6
6
6
10
10
10
7
7
3
3
3
4
4
4
–
–
8
2
2
2
8
–
–
5
5
5
Pad
Pad
Pad
Pin Functions
I/O
DESCRIPTION
I
Battery voltage sense input. Connect to the battery positive terminal. Connect
a 390-Ω resistor from BAT to OUT for I_(OUT) < 200 mA.
I Charge enable input. CE = LO enables charger. CE = HI disables charger.
I
Charge input voltage and internal supply. Connect a 1-μF (minimum)
capacitor from IN to VSS. C_IN ≥ C_OUT
Charge current set point, resistor connected from ISET to VSS sets charge
O current value. Connect a 0.1-μF capacitor from BAT to ISET for I_(OUT) < 200
mA.
O
Charge current output. Connect to the battery positive terminal. Connect a 1-
μF (minimum) capacitor from OUT to VSS.
O Power good status output (open-collector), active low.
O Charge status output 1 (open-collector, see Table 3).
O Charge status output 2 (open-collector, see Table 3).
Termination enable input. TE = LO enables termination detection and battery
I absent detection. TE = HI disables termination detection and battery absent
detection.
I
Safety timer program input, timer disabled if floating. Connect a resistor to
VSS pin to program safety timer timeout value.
I
Temperature sense input, connect to battery pack thermistor. Connect an
external resistive divider to program temperature thresholds.
I Ground
There is an internal electrical connection between the exposed thermal pad
and Vss pin of the IC. The exposed thermal pad must be connected to the
– same potential as the VSS pin on the printed circuit board. Do not use the
thermal pad as the primary ground input for the IC. VSS pin must be
connected to ground at all times.
4
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