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TLC6C598-Q1_16 Datasheet, PDF (4/24 Pages) Texas Instruments – Power Logic 8-Bit Shift Register LED Driver
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TLC6C598-Q1
SLIS142D – DECEMBER 2012 – REVISED SEPTEMBER 2016
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VCC
Logic supply voltage
VI
Logic input-voltage range
VDS
Power DMOS drain-to-source voltage
Continuous total dissipation
TA
Operating ambient temperature
TJ
Operating junction temperature range
Tstg
Storage temperature range
MIN
MAX
–0.3
8
–0.3
8
–0.3
42
See Thermal Information
–40
125
–40
150
–55
165
UNIT
V
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V(ESD) Electrostatic discharge
Human body model (HBM), per AEC Q100-002(1)
Charged device model (CDM), per AEC
Q100-011
All pins
Corner pins (1, 8, 9, and
16)
VALUE
±2000
±750
±750
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
TA
Operating ambient temperature
MIN MAX
3 5.5
2.4
0.7
–40 125
UNIT
V
V
V
°C
6.4 Thermal Information
THERMAL METRIC(1)
TLC6C598-Q1
PW (TSSOP)
D (SOIC)
UNIT
16 PINS
16 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
129.4
55.4
65.8
9.9
65.2
NA
100
°C/W
45
°C/W
40
°C/W
10
°C/W
40
°C/W
NA
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
4
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