TCA9545A Datasheet, PDF (4/30 Pages) Texas Instruments – Low Voltage 4-channel I2C and SMbus Switch With Interrupt Logic and Reset Functions

TCA9545A
SCPS204B – JANUARY 2014 – REVISED MARCH 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_CC
Supply voltage range
V_I
Input voltage range⁽²⁾
I_I
Input current
I_O
Output current
Continuous current through V_CC
Continuous current through GND
P_tot
Total power dissipation
T_A
Operating free-air temperature range
MIN MAX UNIT
–0.5
7V
–0.5
7V
±20 mA
±25 mA
±100 mA
±100 mA
400 mW
–40
85 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
7.2 Handling Ratings
PARAMETER
DEFINITION
T_stg
V_ESD ⁽¹⁾
Storage temperature range
Human Body Model (HBM), ESD Stress Voltage⁽²⁾
Charged Device Model (CDM) ESD Stress Voltage⁽³⁾
All Terminals
All Terminals
MIN MAX UNIT
–65 150 °C
4 kV
1500 V
(1) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by assembly line electrostatic discharges into
the device.
(2) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe
manufacturing with a standard ESD control process. Terminals listed as 250 V may actually have higher performance.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe
manufacturing with a standard ESD control process. Terminals listed as 250 V may actually have higher performance.
7.3 Recommended Operating Conditions⁽¹⁾
MIN
MAX UNIT
V_CC
Supply voltage
V_IH
High-level input voltage
V_IL
Low-level input voltage
T_A
Operating free-air temperature
SCL, SDA
A1, A0, INT3–INT0, RESET
SCL, SDA
A1, A0, INT3–INT0, RESET
1.65
5.5 V
0.7 × V_CC
6
V
0.7 × V_CC V_CC + 0.5
–0.5 0.3 × V_CC
V
–0.5 0.3 × V_CC
–40
85 °C
(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
7.4 Thermal Information
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
TCA9545A
PW
20 TERMINALS
115.3
48.7
66.4
6.5
65.8
UNIT
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Submit Documentation Feedback
Product Folder Links: TCA9545A
Copyright © 2014, Texas Instruments Incorporated