LP3958 Datasheet, PDF (4/36 Pages) National Semiconductor (TI) – Lighting Management Unit with High Voltage Boost Converter

LP3958
SNVS423C – JANUARY 2006 – REVISED MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ^{(1) (2)(3)}
V (SW, FB, MAIN, SUB, KEY1, KEY2, KEY3)
V_DD1, V_DD2, V_DDIO, V_DDA
Voltage on I_KEY, I_RT, V_REF
Voltage on Logic Pins
I (V_REF)
I(KEY1, KEY2, KEY3)
Continuous Power Dissipation ⁽⁴⁾
Junction Temperature (T_J-MAX)
Storage Temperature Range
Maximum Lead Temperature (Soldering) ⁽⁵⁾
ESD Rating ⁽⁶⁾
Human Body Model
Machine Model
-0.3V to +20V
-0.3V to +6.0V
-0.3V to V_DD1+0.3V with 6.0V max
-0.3V to V_DDIO +0.3V with 6.0V max
10µA
100mA
Internally Limited
125ºC
-65ºC to +150ºC
260ºC
2kV
200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pins.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J=150ºC (typ.) and
disengages at T_J=130ºC (typ.).
(5) For detailed soldering specifications and information, please refer to Application Note AN1112: DSBGA Wafer Level Chip Scale
Package
(6) The Human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
Operating Ratings ^{(1) (2)}
V (SW, FB, MAIN, SUB)
0 to +19V
V_DD1,2
V_DDIO
Recommended Load Current (KEY1, KEY2, KEY3) CC Mode
3.0 to 5.5V
1.65V to V_DD1
0mA to 15mA/driver
Recommended Total Boost Converter Load Current
0mA to 70mA
Junction Temperature (T_J)
Ambient Temperature (T_A)⁽³⁾
-30ºC to +125ºC
-30ºC to +85ºC
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pins.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125ºC), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θ_JA), as given by the following equation: T_A-MAX = T_J-MAX-OP – (θ_JA × P_D-MAX).
Thermal Properties
Junction-to-Ambient Thermal Resistance(θ_JA)⁽¹⁾
60 - 100ºC/W
(1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
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