LP3470 Datasheet, PDF (4/22 Pages) National Semiconductor (TI) – Tiny Power On Reset Circuit

LP3470
SNVS003G – JUNE 1999 – REVISED APRIL 2016
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
V_CC voltage
Reset voltage
Output current (Reset)
Power dissipation (T_A = 25°C)⁽³⁾
Lead temperature (soldering, 5 sec)
Junction temperature, T_JMAX
Storage temperature, T_stg
MIN
MAX
UNIT
–0.3
6
V
–0.3
6
V
10
mA
300
mW
260
°C
125
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by T_Jmax (maximum junction temperature),
θ_JA (junction to ambient thermal resistance), and T_A (ambient temperature). The maximum allowable power dissipation at any
temperature is P_Dmax = (T_Jmax − T_A)/ θ_JA or the number given in the Absolute Maximum Ratings, whichever is lower.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_CC
Operating voltage
T_A
Operating temperature
LP3470
LP3470I
MIN
NOM
MAX UNIT
0.5
5.5 V
–20
85
°C
–40
85
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LP3470
DBV (SOT-23)
UNIT
5 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
171
124.8
30.9
17.9
30.4
—
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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