LMH6622 Datasheet, PDF (4/33 Pages) National Semiconductor (TI) – Dual Wideband, Low Noise, 160MHz, Operational Amplifiers

LMH6622
SNOS986E – DECEMBER 2001 – REVISED JULY 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾⁽²⁾
V_IN Differential
Supply Voltage (V⁺ – V^−)
Voltage at Input Pins
SOLDERING INFORMATION
Infrared or Convection (20 sec)
Wave Soldering (10 sec)
Junction Temperature ⁽³⁾
MIN
MAX
UNIT
±1.2
V
13.2
V
V⁺ +0.5,
V^− −0.5
V
235
°C
260
°C
+150
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum power dissipation is a function of T_J(MAX), R_θJA and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) − T_A)/R_θJA. All numbers apply for packages soldered directly onto a PC board.
6.2 Handling Ratings
T_stg
V_(ESD)
Storage temperature range
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins ⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-
C101, all pins⁽³⁾
MIN
−65°
MAX
+150
2000 ⁽²⁾
200 ⁽²⁾
(1) JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.
(2) Human body model, 1.5 kΩ in series with 100 pF. Machine model, 0 Ω in series with 200 pF.
(3) JEDEC document JEP157 states that 200-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
°C
V
6.3 Recommended Operating Conditions⁽¹⁾
Supply Voltage (V⁺– V^−)
Temperature Range⁽²⁾⁽³⁾
MIN
±2.25
−40
MAX
±6
+85
UNIT
V
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(3) The maximum power dissipation is a function of T_J(MAX), R_θJA and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) − T_A)/R_θJA. All numbers apply for packages soldered directly onto a PC board.
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMH6622
Package D
LMH6622
Package DGK
UNIT
R_θJA
Junction-to-ambient thermal resistance⁽²⁾
8 PINS
166°
8 PINS
211°
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of T_J(MAX), R_θJA and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) − T_A)/R_θJA. All numbers apply for packages soldered directly onto a PC board.
4
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