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LMH6550 Datasheet, PDF (4/33 Pages) National Semiconductor (TI) – Differential, High Speed Op Amp
LMH6550
SNOSAK0I – DECEMBER 2004 – REVISED JANUARY 2015
7.3 Recommended Operating Conditions
Operating Temperature
Total Supply Voltage
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MIN
NOM
MAX UNIT
−40
85
°C
4.5
12
V
7.4 Thermal Information
THERMAL METRIC(1)
LMH6550
D
DGK
UNIT
RθJA
Junction-to-ambient thermal resistance (2)
8 PINS
150
8 PINS
235
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient
temperature is P D= (TJ(MAX) — TA)/ θJA. All numbers apply for package soldered directly into a 2 layer PC board with zero air flow.
7.5 Electrical Characteristics: ±5 V(1)
Single-ended in differential out, TA = 25°C, VS = ±5 V, VCM = 0 V, RF = RG = 365 Ω, RL = 500 Ω; unless specified.
PARAMETER
TEST CONDITIONS
MIN (2) TYP (3) MAX (2)
AC PERFORMANCE (DIFFERENTIAL)
SSBW
LSBW
Small Signal −3 dB Bandwidth
Large Signal −3 dB Bandwidth
Large Signal −3 dB Bandwidth
0.1 dB Bandwidth
Slew Rate
VOUT = 0.5 VPP
VOUT = 2 VPP
VOUT = 4 VPP
VOUT = 0.5 VPP
4-V Step (4)
2000
400
380
320
90
3000
Rise/Fall Time
2-V Step
1
Settling Time
2-V Step, 0.1%
8
VCM PIN AC PERFORMANCE (COMMON-MODE FEEDBACK AMPLIFIER)
Common-Mode Small Signal
VCM Bypass Capacitor Removed
210
Bandwidth
Slew Rate
DISTORTION AND NOISE RESPONSE
HD2
2nd Harmonic Distortion
HD3
3rd Harmonic Distortion
en
Input Referred Voltage Noise
in
Input Referred Noise Current
INPUT CHARACTERISTICS (DIFFERENTIAL)
VCM Bypass Capacitor Removed
VO = 2 VPP, f = 5 MHz, RL = 800 Ω
VO = 2 VPP, f = 20 MHz, RL = 800 Ω
VO = 2 VPP, f = 70 MHz, RL = 800 Ω
VO = 2 VPP, f = 5 MHz, RL = 800 Ω
VO = 2 VPP, f = 20 MHz, RL = 800 Ω
VO = 2 VPP, f = 70 MHz, RL = 800 Ω
f ≥ 1 MHz
f ≥ 1 MHz
200
−92
−78
−59
−103
−88
−50
6.0
1.5
VOSD
Input Offset Voltage
Input Offset Voltage Average
Temperature Drift
IBI
Input Bias Current
Differential Mode, VID =
0, VCM = 0
(5)
At extreme
temperatures
(6)
1
±4
±6
1.6
0
-8
−16
UNIT
MHz
MHz
MHz
MHz
V/μs
ns
ns
MHz
V/µs
dBc
dBc
nV/√Hz
pA/√Hz
mV
µV/°C
µA
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using
Statistical Quality Control (SQC) methods.
(3) Typical numbers are the most likely parametric norm.
(4) Slew Rate is the average of the rising and falling edges.
(5) Drift determined by dividing the change in parameter at temperature extremes by the total temperature change.
(6) Negative input current implies current flowing out of the device.
4
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