DRV8839_16 Datasheet, PDF (4/25 Pages) Texas Instruments – Low-Voltage Dual H-Bridge Driver IC

DRV8839
SLVSBN4B – JANUARY 2013 – REVISED DECEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings ^{(1) (2)}
Over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
Power supply voltage, VM
Power supply voltage, VCC
Digital input pin voltage
Peak motor drive output current
T_J
Operating junction temperature
T_stg
Storage temperature
MIN
MAX
–0.3
12
–0.3
7
–0.5
7
Internally limited
–40
150
–60
150
UNIT
V
V
V
A
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±4000
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
T_A = 25°C (unless otherwise noted)
V_CC
V_M
V_IN
I_OUT
f_PWM
Device power supply voltage
Motor power supply voltage
Logic level input voltage
H-bridge output current ⁽¹⁾
Externally applied PWM frequency
(1) Power dissipation and thermal limits must be observed.
MIN
NOM
MAX UNIT
1.8
7
V
0
11
V
0
5.5
V
0
1.8
A
0
250
kHz
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DRV8839
DSS (WSON)
UNIT
12 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
50.4
°C/W
58
°C/W
19.9
°C/W
0.9
°C/W
20
°C/W
6.9
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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