DRV8803_16 Datasheet, PDF (4/26 Pages) Texas Instruments – Quad Low-Side Driver IC

DRV8803
SLVSAW5C – JULY 2011 – REVISED NOVEMBER 2015
www.ti.com
6 Specification
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
VM
VOUTx
VCLAMP
nFAULT
nFAULT
T_J
T_stg
Power supply voltage
Output voltage
Clamp voltage
Output current
Peak clamp diode current
DC or RMS clamp diode current
Digital input pin voltage
Digital output pin voltage
Peak motor drive output current, t < 1 μS
Continuous total power dissipation
Operating virtual junction temperature
Storage temperature
MIN
MAX
–0.3
65
–0.3
65
–0.3
65
20
2
1
–0.5
7
–0.5
7
Internally limited
See Thermal Information
–40
150
–60
150
UNIT
V
V
V
mA
A
A
V
V
A
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾
VALUE
±3000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
V_M
Power supply voltage
V_CLAMP Output clamp voltage⁽¹⁾
I_OUT
Continuous output current
SOIC package⁽²⁾, T_A = 25°C
HTSSOP package⁽²⁾, T_A = 25°C
Single channel on
Four channels on
Single channel on
Four channels on
(1) V_CLAMP is used only to supply the clamp diodes. It is not a power supply input.
(2) Power dissipation and thermal limits must be observed.
MIN NOM MAX UNIT
8.2
60 V
0
60 V
1.5
0.8
A
2
1
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DRV8803
DW (SOIC) PWP (HTSSOP) UNIT
20 PINS
16 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
67.7
39.6
°C/W
32.9
24.6
°C/W
35.4
20.3
°C/W
8.2
0.7
°C/W
34.9
20.1
°C/W
N/A
2.3
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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