DRV10964 Datasheet, PDF (4/27 Pages) Texas Instruments – Three-Phase Sinusoidal Sensorless BLDC Motor Driver

DRV10964
SLDS227 – MARCH 2016
6 Specifications
www.ti.com
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ^{(1) (2)}
MIN
VCC pin supply voltage
–0.3
Motor phase pins (U, V, W)
–1
Direction, speed indicator input, and speed input (FR, FGS, PWM, CONFIG)
–0.3
Speed output (FG)
–0.3
T_J
Junction temperature
–40
T_SDR
Maximum lead soldering temperature, 10 seconds
T_stg
Storage temperature
–55
MAX
6
7.7
6
7.7
150
260
150
UNIT
V
V
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground.
6.2 ESD Ratings
V_(ESD)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 ⁽¹⁾
Electrostatic discharge _{Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)}
VALUE
±2500
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VCC
U, V, W
FR, FGS, PWM, CONFIG
FG
T_J
VCC pin supply voltage
Motor phase pins
Direction, speed indicator input, and speed input
Speed output
Junction temperature
MIN
MAX UNIT
2.1
5.5 V
–0.7
7V
–0.1
5.5 V
–0.1
7.5 V
–40
125 °C
6.4 Thermal Information
THERMAL METRIC ⁽¹⁾
DRV10964
DSN (USON)
UNIT
10 PINS
R_{θ JA}
R_{θ JC(top)}
R_{θ JB}
ψ_JT
ψ_JB
R_{θ JC(bot)}
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
40.9
°C/W
46.6
°C/W
15.8
°C/W
0.5
°C/W
16
°C/W
2.9
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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