DRV10964 Datasheet, PDF (20/27 Pages) Texas Instruments – Three-Phase Sinusoidal Sensorless BLDC Motor Driver

DRV10964
SLDS227 – MARCH 2016
www.ti.com
9 Power Supply Recommendations
The DRV10964 is designed to operate from an input voltage supply, V(VCC), range from 2.1 and 5.5 V. The user
must place a 2.2-μF ceramic capacitor rated for VCC as close as possible to the VCC and GND pin.
10 Layout
10.1 Layout Guidelines
The package uses an exposed pad to remove heat from the device. For proper operation, this pad must be
thermally connected to copper on the PCB to dissipate heat. On a multi-layer PCB with a ground plane, this can
be accomplished by adding a number of vias to connect the thermal pad to the ground plane. On PCBs without
internal planes, copper area can be added on either side of the PCB to dissipate heat. If the copper area is on
the opposite side of the PCB from the device, thermal vias are used to transfer the heat between top and bottom
layers.
For details about how to design the PCB, refer to TI application report, PowerPAD™ Thermally Enhanced
Package (SLMA002), and TI application brief, PowerPAD™ Made Easy (SLMA004), available at www.ti.com. In
general, the more copper area that can be provided, the more power can be dissipated.
10.2 Layout Example
100k
2.2 uF
FG 1
100k
FGS 2
VCC 3
W4
GND 5
GND
GND
(PPAD)
10 PWM
9 CONFIG
8 FR
7U
6V
Figure 21. DRV10964 Layout Example
20
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