BQ24314C Datasheet, PDF (4/26 Pages) Texas Instruments – Li+ Charger Front-End Protection IC

bq24314C
SLUSAV3A – AUGUST 2012 – REVISED JULY 2015
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
IN (with respect to VSS)
V_I Input voltage
OUT (with respect to VSS)
ILIM, FAULT, CE, VBAT (with respect to VSS)
I_I
Input current
IN
I_O Output current OUT
Output sink
current
FAULT
T_J Junction temperature
T_stg Storage temperature
MIN
MAX
UNIT
–0.3
30
–0.3
12
V
–0.3
7
2
A
2
A
15
mA
–40
150
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
IN(IEC 61000-4-2)⁽³⁾
Air Discharge
Contact
VALUE
±2000
±500
±15000
±8000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) With IN bypassed to the VSS with a 1-μF low-ESR ceramic capacitor
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_IN
I_IN
I_OUT
R_ILIM
T_J
Input voltage range
Input current, IN pin
Output current, OUT pin
OCP Programming resistor
Junction temperature
MIN
NOM
MAX UNIT
3
30
V
1.5
A
1.5
A
15
90
kΩ
–40
125
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq24314C
DSG (WSON)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
58.6
°C/W
67.9
°C/W
29.7
°C/W
1.2
°C/W
30.3
°C/W
7.6
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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