HD3SS3220 Datasheet, PDF (38/43 Pages) Texas Instruments – USB Type-C DRP Port Controller with SuperSpeed 2:1 MUX

RNH0030A
PACKAGE OUTLINE
WQFN - 0.8 mm max height
SCALE 3.300
PLASTIC QUAD FLATPACK - NO LEAD
A
2.6
2.4
B
PIN 1 INDEX AREA
4.6
4.4
0.8 MAX
0.05
0.00
C
SEATING PLANE
0.08
4X (0.2)
26X 0.4
11
10
2X 1.6
1.2±0.05
15
16
EXPOSED
THERMAL PAD
2X
3.6
3.2±0.05
(0.2) TYP
1
25
PIN 1 ID
(OPTIONAL)
30
26
30X
0.35
0.25
30X
0.25
0.15
0.1 C A B
0.05
NOTES:
4221819/A 04/2015
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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