THS3201-EP_14 Datasheet, PDF (3/34 Pages) Texas Instruments – 1.8-GHz LOW-DISTORTION CURRENT-FEEDBACK AMPLIFIER

THS3201-EP
www.ti.com ..................................................................................................................................................... SGLS283B – APRIL 2005 – REVISED JANUARY 2009
1G
100M
80°C, 74M Hrs
10M
100°C, 5.9M Hrs
1M
100K
120°C, 490K Hrs
140°C, 58K Hrs
10K
80
90
100
110
120
130
140
150
T_J − Junction Temperature − °C
Figure 1. EME-G600 Estimated Wirebond Life
DISSIPATION RATINGS
PACKAGE
D (8)
DGN (8)⁽²⁾
0_JC
(°C/W)
38.3
4.7
0_JA ⁽¹⁾
(°C/W)
97.5
58.4
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) The THS3201 may incorporate a thermal pad on the underside of the chip. This acts as a heat sink and must be connected to a
thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature;
which could permanently damage the device. See Texas Instruments technical briefs SLMA002 and SLMA004 for more information
about utilizing the PowerPAD thermally enhanced package.
RECOMMENDED OPERATING CONDITIONS
Supply voltage
T_A
Operating free air temperature
MIN MAX UNIT
Dual supply
±3.3 ±7.5
V
Single supply
6.6
15
–55
125
°C
PART NUMBER
THS3201MDEP ⁽¹⁾
THS3201MDREP ⁽¹⁾
THS3201MDGNEP ⁽¹⁾
THS3201MDGNREP
(1) Product Preview
PACKAGE/ORDERING INFORMATION
PACKAGE TYPE
SOIC-8
PACKAGE MARKING
—
MSOP-8-PP
BLM
TRANSPORT MEDIA, QUANTITY
Rails, 75
Tape and reel, 2500
Rails, 80
Tape and reel, 2500
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