THS3201-EP_14 Datasheet, PDF (22/34 Pages) Texas Instruments – 1.8-GHz LOW-DISTORTION CURRENT-FEEDBACK AMPLIFIER

THS3201-EP
SGLS283B – APRIL 2005 – REVISED JANUARY 2009 ..................................................................................................................................................... www.ti.com
impossible to achieve a smooth, stable frequency
response. Best results are obtained by soldering
THS3201 parts directly onto the board.
PowerPAD Design Considerations
The THS3201 is available in a thermally-enhanced
PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which
the die is mounted [see Figure 63(a) and
Figure 63(b)]. This arrangement results in the lead
frame being exposed as a thermal pad on the
underside of the package [see Figure 63(c)]. Because
this thermal pad has direct thermal contact with the
die, excellent thermal performance can be achieved
by providing a good thermal path away from the
thermal pad.
The PowerPAD package allows for both assembly
and thermal management in one manufacturing
operation. During the surface-mount solder operation
(when the leads are being soldered), the thermal pad
can also be soldered to a copper area underneath the
package. Through the use of thermal paths within this
copper area, heat can be conducted away from the
package into either a ground plane or other
heat-dissipating device.
The PowerPAD package represents a breakthrough
in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward
mechanical methods of heatsinking.
DIE
Side View (a)
DIE
Thermal
Pad
End View (b)
Bottom View (c)
Figure 63. Views of Thermally Enhanced Package
Although there are many ways to properly heat sink
the PowerPAD package, the following steps define
the recommended approach.
Pin 1
0.030
0.075
0.205
0.060
0.013
0.017
0.025 0.094
0.010
vias
0.035
0.040
Top View
Figure 64. DGN PowerPAD PCB Etch and Via
Pattern
PowerPAD PCB Layout Considerations
1. Prepare the PCB with a top-side etch pattern as
shown in Figure 64. There should be etch for the
leads as well as etch for the thermal pad.
2. Place five holes in the area of the thermal pad.
These holes should be 10 mils in diameter. Keep
them small so that solder wicking through the
holes is not a problem during reflow.
3. Additional vias may be placed anywhere along
the thermal plane outside of the thermal-pad
area. This helps dissipate the heat generated by
the THS3201 IC. These additional vias may be
larger than the 10-mil diameter vias directly under
the thermal-pad. They can be larger because
they are not in the thermal pad area to be
soldered so that wicking is not a problem.
4. Connect all holes to the internal ground plane.
5. When connecting these holes to the ground
plane, do not use the typical web or spoke via
connection methodology. Web connections have
a high thermal resistance connection that is
useful for slowing the heat transfer during
soldering operations. This makes the soldering of
vias that have plane connections easier. In this
application, however, low thermal resistance is
desired for the most efficient heat transfer.
Therefore, the holes under the THS3201
PowerPAD package should make their
connection to the internal ground plane with a
complete connection around the entire
circumference of the plated-through hole.
6. The top-side solder mask should leave the
terminals of the package and the thermal-pad
area with its five holes exposed. The bottom-side
solder mask should cover the five holes of the
thermal-pad area. This prevents solder from
22
Submit Documentation Feedback
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): THS3201-EP