OPA4317 Datasheet, PDF (3/30 Pages) Texas Instruments – Low-Offset, Rail-to-Rail I/O Operational Amplifier

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OPA317
OPA2317
OPA4317
SBOS682A – MAY 2013 – REVISED JUNE 2013
THERMAL INFORMATION: OPA317
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
D (SOIC)
8 PINS
140.1
89.8
80.6
28.7
80.1
N/A
OPA317
DBV (SOT23)
5 PINS
220.8
97.5
61.7
7.6
61.1
N/A
DCK (SC70)
5 PINS
298.4
65.4
97.1
0.8
95.5
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2317
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
D (SOIC)
8 PINS
124.0
73.7
64.4
18.0
63.9
N/A
OPA2317
DGK (MSOP)
8 PINS
180.3
48.1
100.9
2.4
99.3
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA4317
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
D (SOIC)
14 PINS
83.8
70.7
59.5
11.6
37.7
N/A
OPA4317
PW (TSSOP)
14 PINS
120.8
34.3
62.8
1.0
56.5
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2013, Texas Instruments Incorporated
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