OPA4317 Datasheet, PDF (12/30 Pages) Texas Instruments – Low-Offset, Rail-to-Rail I/O Operational Amplifier

OPA317
OPA2317
OPA4317
SBOS682A – MAY 2013 – REVISED JUNE 2013
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GENERAL LAYOUT GUIDELINES
Attention to good layout practice is always recommended. Keep traces short and, when possible, use a printed
circuit board (PCB) ground plane with surface-mount components placed as close to the device pins as possible.
Place a 0.1-μF capacitor closely across the supply pins. Apply these guidelines throughout the analog circuit to
improve performance and provide benefits, such as reducing the electromagnetic interference (EMI)
susceptibility.
Optimize circuit layout and mechanical conditions for lowest offset voltage and precision performance. Avoid
temperature gradients that create thermoelectric (Seebeck) effects in the thermocouple junctions formed from
connecting dissimilar conductors. These thermally-generated potentials can be made to cancel by assuring they
are equal on both input terminals. Other layout and design considerations include:
• Use low thermoelectric-coefficient conditions (avoid dissimilar metals).
• Thermally isolate components from power supplies or other heat sources.
• Shield op amp and input circuitry from air currents, such as cooling fans.
Following these guidelines reduces the likelihood of junctions being at different temperatures, which can cause
thermoelectric voltages of 0.1 μV/°C or higher, depending on the materials used.
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