DRV8830_16 Datasheet, PDF (3/22 Pages) Texas Instruments – Low-Voltage Motor Driver With Serial Interface

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5 Pin Configuration and Functions
DRV8830
SLVSAB2G – MAY 2010 – REVISED DECEMBER 2015
DGQ or DRC Package
10-Pin HVSSOP or VSON
Top View
OUT2 1
ISENSE ²
OUT1 ³
VCC ⁴
GND ⁵
GND
(Thermal
Pad)
10 SCL
9 SDA
8 A1
7 A0
6 FAULTn
The HVSSOP package has a PowerPAD.
NAME
A0
A1
PIN
NO.
7
8
FAULTn
6
GND
5
ISENSE
2
OUT1
3
OUT2
1
SCL
10
SDA
9
VCC
4
TYPE ⁽¹⁾
Pin Functions
DESCRIPTION
I
Address set 0
I
Address set 1
OD
Fault output
—
Device ground
IO
Current sense resistor
O
Bridge output 1
O
Bridge output 2
I
Serial clock
IO
Serial data
—
Device and motor supply
EXTERNAL COMPONENTS
OR CONNECTIONS
Connect to GND, VCC, or open to set I²C
base address. See serial interface description.
Open-drain output driven low if fault condition
present
Connect current sense resistor to GND.
Resistor value sets current limit level.
Connect to motor winding
Clock line of I²C serial bus
Data line of I²C serial bus
Bypass to GND with a 0.1-μF (minimum)
ceramic capacitor.
(1) Directions: I = input, O = output, OZ = tri-state output, OD = open-drain output, IO = input/output
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
VCC Power supply voltage
Input pin voltage
Peak motor drive output current⁽³⁾
Continuous motor drive output current⁽³⁾
Continuous total power dissipation
T_J Operating virtual junction temperature
T_stg Storage temperature
MIN
MAX
–0.3
7
–0.5
7
Internally limited
–1
1
See Thermal Information
–40
150
–60
150
UNIT
V
V
A
A
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Power dissipation and thermal limits must be observed.
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