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BQ24070RHLRG4 Datasheet, PDF (3/31 Pages) Texas Instruments – SINGLE-CHIP LI-ION CHARGE AND SYSTEM POWER-PATH MANAGEMENT IC
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bq24070
bq24071
SLUS694F – MARCH 2006 – REVISED DECEMBER 2009
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
Input voltage
IN (DC voltage with respect to VSS)
Input voltage
BAT, CE, DPPM, PG, Mode, OUT, ISET1, ISET2, STAT1,
STAT2, TS, (all DC voltages wrt VSS)
VREF (DC voltage wrt VSS)
TMR
Input current
Output current
OUT
BAT (2)
Output source current (in
regulation at 3.3 V VREF)
Output sink current
VREF
PG, STAT1, STAT2,
Storage temperature range, Tstg
Junction temperature range, TJ
Lead temperature (soldering, 10 seconds)
bq24070/1
–0.3 V to 18 V
–0.3 V to 7 V
–0.3 V to VO(OUT) + 0.3 V
–0.3 V to VO + 0.3 V
3.5 A
4A
–4 A to 3.5 A
30 mA
15 mA
–65°C to 150°C
–40°C to 150°C
300°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) Negative current is defined as current flowing into the BAT pin.
RECOMMENDED OPERATING CONDITIONS
VCC Supply voltage (VIN) (1)
IAC Input current
TJ Operating junction temperature range
(1) Verify that power dissipation and junction temperatures are within limits at maximum VCC .
MIN
MAX UNIT
4.35
16 V
2A
–40
125 °C
DISSIPATION RATINGS
PACKAGE
20-pin RHL(1)
TA ≤ 40°C
POWER RATING
1.81 W
DERATING FACTOR
TA > 40°C
21 mW/°C
θJA
46.87 °C/W
(1) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is
connected to the ground plane by a 2×3 via matrix.
Copyright © 2006–2009, Texas Instruments Incorporated
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