AM1808_12 Datasheet, PDF (258/262 Pages) Texas Instruments – ARM Microprocessor

PACKAGE OPTION ADDENDUM
www.ti.com
7-Sep-2012
PACKAGING INFORMATION
Orderable Device
AM1808BZCE3
AM1808BZCE4
AM1808BZCEA3
AM1808BZCED4
AM1808BZWT3
AM1808BZWT4
AM1808BZWTA3
AM1808BZWTD4
Status ^{(1) Package Type Package}
Drawing
ACTIVE
NFBGA
ZCE
Pins
361
Package Qty
160
ACTIVE
NFBGA
ZCE
361
160
ACTIVE
NFBGA
ZCE
361
160
ACTIVE
NFBGA
ZCE
361
160
ACTIVE
NFBGA
ZWT
361
90
ACTIVE
NFBGA
ZWT
361
90
ACTIVE
NFBGA
ZWT
361
90
ACTIVE
NFBGA
ZWT
361
90
Eco Plan ⁽²⁾
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp ⁽³⁾
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(Requires Login)
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Addendum-Page 1